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Product specification
4
Chip Resistor Surface Mount
RC
SERIES
0201
9
MARKING
RC0201
No marking
ynsc007
Fig. 1
For further marking information, please refer to data sheet “Chip resistors marking ”.
CONSTRUCTION
The resistor is constructed on
O U T L I N E S
top of a high-grade ceramic body.
Internal metal electrodes are
added on each end to make the
contacts to the thick film resistive
element. The composition of the
resistive element is a noble metal
imbedded into a glass and
covered by a second glass to
prevent environment influences.
The resistor is laser trimmed to
the rated resistance value. The
resistor is covered with a
protective epoxy coat, finally the
two external terminations (matte
tin on Ni-barrier) are added, as
shown in Fig.2.
For dimension, please refer to Table 1
H
I2
I 1
W
overcoat
protective glass
resistive layer
(Jumper chip is a conductor)
inner electrode
termination(Ni/matte tin)
inner electrode
ceramic substrate
overcoat
YNSC056
L
DIMENSIONS
Table 1
TYPE
L (mm)
W (mm)
H (mm)
I 1 (mm)
I 2 (mm)
RC0201
0.60 ±0.03
0.30 ±0.03
0.23 ±0.03
0.10 ±0.05
0.15 ±0.05
Fig. 2 Chip resistor outlines
www.yageo.com
May 02, 2011 V.8
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